IBM Thermal Conduction Module (TCM) 3090 mainframe with huge heatsink GOLD For Sale

IBM Thermal Conduction Module (TCM) 3090 mainframe with huge heatsink GOLD


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IBM Thermal Conduction Module (TCM) 3090 mainframe with huge heatsink GOLD :
$649

Amazing IBM die packaging and cooling technology
Extremely Rare.
Introduced in 1985, the 3090 contained four central processors and 128 megabytes of central storage. It was a follow-on to the IBM 3081 series that introduced TCM technology. This was the first processor to implement an ECL bipolar circuit TCM, very fast, but very hot.
Six inches square, and 3.5 pounds, the 3090 TCM had room for up to 132 chips, each with 612 ECL circuits.
Each ceramic block of the material had 20 to 22 differently wired layers.
More than 470,000 holes provided paths for the vertical wiring for layer-to-layer communication.
The chips were joined to the substrate through a total of nearly 18,000 contact points, using IBM's unique chip-joining technology.
All that circuitry generated 525 watts of heat -- enough to destroy the chips.
But the heat was drawn off through spring-loaded aluminum pistons that pressed gently against the back of each chip.
In turn, the pistons were housed in a "hat" (heatplate) filled with helium,
an excellent heat conductor. Many were water cooled. Some air cooled.One TCM alone -- there were about nine in a 3090 computer -- packed as much computing power as a medium-size System/370 of only a decade before.
In the 1980's these TCMs would had a value of about $250K-350K each.
Made in 1990 in the USA. Date code 9052.This TCM was helium and air cooled and dissipated about 525 watts of heat.
The large side bolt is for helium.
The huge heat sink is extremely rare.90 mm x 90 mm layered ceramic substrate with gold wiring layers1800 gold plated pins (see photos)gold plated frameMost of these have been melted or trashed. Disappearing fast.Used - as is.
No returnsRulers not included.For more information:
google
3090 tcm
ibm tcm collection
ibm tcm glennsmuseum
See IBM Journal Research and Development Vol 35 Number 3 May 1991


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