Rare IBM TCM -Thermal Conduction Module - ES/3090 Mainframe For Sale
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Rare IBM TCM -Thermal Conduction Module - ES/3090 Mainframe:
$503.00
The Thermal Conduction Module - TCM - was a packaging technology IBM developed for its mainframes that packed large numbers of fairly power hungry and hot chips into a water cooled module to achieve high density and reliability. It is built on a many layer ceramic substrate (38 for the 3090 TCMs) and up to 132 chips arrayed on the substrate. The package was designed to conduct heat away from the chips very efficiently and to a plate with circulating cold water for removal from the machine.This module was used in an IBM 3090 mainframe. IBM first developed the TCM for the 308x mainframe generation; the successor generation, 3090, was an evolution of that technology to a new generation. The 3090 shifted from the prior generations use of TTL to faster and hotter ECL (emitter coupled logic). Each logic chip implements 612 circuits, although a typical TCM had some RAM chips interspersed between the logic chips.
The 3090 was announced in early 1985 replacing the earlier 308x systems (announced in 1980.)
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